Silicon Valley raw lamination press lines delivering controlled dielectric Rogers, Nelco RF, dynamic rigid-flex films, and sub-3mil microvias up to 56 layers.
High-speed robotic pick-and-place arrays handling 01005 passives and 0.3mm BGA packages under nitrogen reflow and strict Class 3 solder fillet controls.
Complete validation scans using 3D tomographic X-Ray (AXI), fixtureless flying probe arrays, active component baking, and AS6081 counterfeit screening.
Highly reliable, precision-engineered components and products that are essential to our customers’ advanced Aviation, Defense, Security, and Space programs and systems.
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Design, development, manufacturing, and inspection for innovative Class II and Class III Medical Devices and other FDA-compliant Life Science solutions.
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Specialized capabilities and diagnostics for Tech Industrial customers in the Communication, Instrumentation, Energy & Environmental, and Transportation sectors.
View Solutions ›End-to-end electronics manufacturing services engineered to support complex, high-reliability products from prototype to full-scale production.
Advanced PCBA manufacturing services delivering precision, scalability, and reliability across all production volumes.
High-reliability microelectronics solutions designed for size, weight, performance, and mission-critical applications.
Engineering expertise that accelerates design for manufacturability, cost optimization, and time-to-market.
Precision PCB fabrication supporting complex, high-density designs with strict quality and reliability requirements.
Comprehensive AOI, flying probe, functional testing, and 3D X-ray inspection to ensure product integrity.
Complete electromechanical and box build assembly under one roof, enabling faster integration and delivery.
